HF115AC-0.0055-AC-58 is out of stock and can be placed on backorder.
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A10832-02
Laird Technologies - Thermal Materials
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Unit Price: $77.31000
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HF115TAAC-54, 58
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HF115AC-0.0055-AC-58

DigiKey Part Number
BER168-ND
Manufacturer
Bergquist
Manufacturer Product Number
HF115AC-0.0055-AC-58
Description
THERM PAD 19.05MMX12.7MM W/ADH
Manufacturer Standard Lead Time
10 Weeks
Customer Reference
Detailed Description
Thermal Pad Gray 19.05mm x 12.70mm Rectangular Adhesive - One Side
Datasheet
 Datasheet
Product Attributes
Type
Description
Select All
Category
Manufacturer
Bergquist
Series
Hi-Flow® 115-AC
Packaging
Bulk
Part Status
Active
Usage
TO-220
Type
Pad, Sheet
Shape
Rectangular
Outline
19.05mm x 12.70mm
Thickness
0.0055" (0.140mm)
Material
Phase Change Compound
Adhesive
Adhesive - One Side
Backing, Carrier
Fiberglass
Color
Gray
Thermal Resistivity
0.35°C/W
Thermal Conductivity
0.8W/m-K
Shelf Life
12 Months
Shelf Life Start
Date of Manufacture
Storage/Refrigeration Temperature
-
Base Product Number
HF115AC
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Quantity
All prices are in CAD
Bulk
QuantityUnit PriceExt Price
1$0.68000$0.68
10$0.60200$6.02
25$0.57280$14.32
50$0.55180$27.59
100$0.53200$53.20
300$0.50187$150.56
500$0.48842$244.21
1,000$0.47078$470.78
5,000$0.43216$2,160.80
Manufacturers Standard Package
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